System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure

ABSTRACT

The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

The present application is a divisional application of U.S. applicationSer. No. 12/009,393, filed Jan. 18, 2008, now U.S. Pat. No. 8,137,498,which is a continuation-in-part of U.S. application Ser. No. 11/214,518,filed Aug. 30, 2005, now U.S. Pat. No. 7,566,254, and acontinuation-in-part of U.S. application Ser. No. 11/215,683, filed Aug.30, 2005, now U.S. Pat. No. 7,435,311. All of these applications areincorporated herein by reference in their entireties.

The present application incorporates by reference in their entiretieseach of the following applications: U.S. application Ser. No.12/009,375, filed Jan. 18, 2008, entitled: “Substrate Lamination Systemand Method” filed Jan. 18, 2008 and having Express Mail Mailing LabelNumber EM 117518596 US; U.S. application Ser. No. 12/009,482, filed Jan.18, 2008, entitled: “Substrate Lamination System and Method” filed Jan.18, 2008 and having Express Mail Mailing Label Number EM 117518605 US;U.S. application Ser. No. 12/009,372, filed Jan. 18, 2008, entitled:“System and Method for Disassembling Laminated Substrates” filed Jan.18, 2008 and having Express Mail Mailing Label Number EM 117518675 US;U.S. application Ser. No. 12/009,373, filed Jan. 18, 2008, entitled:“Alignment System and Method Thereof” filed Jan. 18, 2008 and havingExpress Mail Mailing Label Number EM 117518667 US; and U.S. applicationSer. No. 12/009,472, filed Jan. 18, 2008, entitled: “PlanarizationTreatment of Pressure Sensitive Adhesive for Rigid-to-Rigid SubstrateLamination” filed Jan. 18, 2008 and having Express Mail Mailing LabelNumber EM 117518653 US.

FIELD OF THE INVENTION

The present invention relates to the field of lamination processes andparticularly to a system and method for completing lamination ofrigid-to-rigid substrates by the controlled application of pressure.

BACKGROUND

Currently existing lamination processes, such as manual, liquidlamination processes, may be used for rigid-to-rigid substratelamination. However, such processes may be time-consuming, inefficient,expensive and/or capital intensive. Alternatively, other currentlyexisting lamination processes, such as dry-film lamination processes,may not be suitable for use in rigid-to-rigid substrate laminationbecause said dry-film lamination processes may produce laminatedassemblies in which voids or bubbles (due to gas entrapment occurringduring the lamination process) are present therein. For example, if thelaminated assembly is a display assembly, said voids or bubbles maycause the appearance of undesirable optical effects or visual anomalies,such as visible blotches in the display. Further, said dry-filmlamination processes may result in/may produce one or more of thefollowing: substrate breakage; laminated assemblies having poorperformance; and/or laminated assemblies having poor repairability. Theabove-referenced shortcomings of the dry-film lamination processes maybe due at least in part to lack of intimate substrate contact via theadhesive material during lamination.

Thus, it would be desirable to provide a system and method forperforming rigid-to-rigid substrate lamination which obviates theproblems associated with current solutions.

SUMMARY

Accordingly, an embodiment of the present invention is directed to asystem/apparatus for performing rigid-to-rigid substrate laminationprocesses implementing pressure-sensitive adhesive (PSA), including: abase portion, the base portion being configured with a support surfacefor supporting at least one laminate assembly stack, each laminateassembly stack included in the at least one laminate assembly stackincluding at least one layer of PSA, a first substrate, and a secondsubstrate, the at least one layer of PSA being positioned between thefirst substrate and the second substrate, the base portion being furtherconfigured with a vacuum port for allowing the base portion to beconnected with a vacuum pump; a cover portion configured for beingconnected with the base portion, the cover portion further configuredfor forming an enclosure with the base portion when the apparatus isestablished in a closed position, the cover portion being configuredwith at least one pressurization port for allowing the cover portion tobe connected with at least one pressurization source; and at least oneflexible membrane configured for being at least one of connected to thecover portion, connected to the base portion, or positioned between thecover portion and the base portion, the at least one flexible membraneand the cover portion forming a first sealed cavity when the apparatusis established in the closed position, the at least one flexiblemembrane and base portion forming a second sealed cavity when theapparatus is established in the closed position, when a pressure iscreated within the first sealed cavity via the pressurization port andwhen a vacuum is created within the second sealed cavity via the vacuumport, the at least one flexible membrane further configured for applyingsaid pressure to the at least one laminate assembly stack while saidvacuum is applied to the at least one laminate assembly stack, whereinat least one of a magnitude, duration or location of the appliedpressure is selectably controllable, the applied pressure and appliedvacuum promoting intimate contact between the first substrate and thesecond substrate via the PSA layer(s) for the at least one laminateassembly stack during rigid-to-rigid substrate lamination processes.

A further embodiment of the present invention is directed to a processfor performing rigid-to-rigid substrate lamination implementingpressure-sensitive adhesive (PSA), including: pressurizing a firstsealed cavity to a first pressure; creating a vacuum within a secondsealed cavity, the second sealed cavity being sealed from the firstsealed cavity by a flexible membrane; applying the first pressure to alaminate assembly stack via the flexible membrane, the laminate assemblystack including a first substrate, a second substrate, and a PSA layer,the PSA layer being positioned between the first substrate and thesecond substrate; and applying the vacuum created within the secondsealed cavity to the laminate assembly stack, wherein the applied firstpressure and the applied vacuum promote intimate contact between thefirst substrate and the second substrate of the laminate assembly stackvia the PSA layer.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not necessarily restrictive of the invention as claimed. Theaccompanying drawings, which are incorporated in and constitute a partof the specification, illustrate embodiments of the invention andtogether with the general description, serve to explain the principlesof the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The numerous advantages of the present invention may be betterunderstood by those skilled in the art by reference to the accompanyingfigures in which:

FIG. 1 is a cross-sectional view of an apparatus/system for performingrigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus implementing a singleflexible membrane applying pressure to multiple, discreet laminateassembly stacks in accordance with an exemplary embodiment of theinvention;

FIG. 2 is a cross-sectional view of the apparatus shown in FIG. 1, saidapparatus implementing a single flexible membrane applying pressure tomultiple laminate assembly stacks, said multiple laminate assemblystacks having a common/shared substrate in accordance with an exemplaryembodiment of the invention;

FIG. 3 is a cross-sectional view of an apparatus for performingrigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus having a plurality ofsealed sub-cavities/pressure zones and a plurality of base receptaclesin accordance with an alternative exemplary embodiment of the presentinvention;

FIG. 4 is a cross-sectional view of an apparatus for performingrigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus having a plurality ofsealed sub-cavities/pressure zones, said apparatus applying pressure(s)created within said sub-cavities/pressure zones to a plurality oflaminate assembly stacks positioned within a sealed cavity formed by thebase and the flexible membrane in accordance with an exemplaryembodiment of the present invention;

FIG. 5 is a cross-sectional view of the apparatus shown in FIG. 4, saidview depicting application of pressure to a single laminate assemblystack in accordance with an exemplary embodiment of the presentinvention;

FIG. 6 is a cross-sectional view of an apparatus for performingrigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus implementing multipleflexible membranes for applying pressure(s) to multiple, discreet (noshared layers between stacks) laminate assembly stacks in accordancewith an exemplary embodiment of the present invention;

FIG. 7 is a cross-sectional view of the apparatus shown in FIG. 6, saidapparatus applying pressure(s) to a single laminate assembly stack inaccordance with an exemplary embodiment of the present invention;

FIG. 8 is a cross-sectional view of an apparatus for performingrigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus not implementingflexible membrane-applied pressure, but rather relying at leastsubstantially on substrate weight and gas evacuation for applyingpressure and for providing intimate substrate contact during saidlamination processes in accordance with an exemplary embodiment of thepresent invention;

FIGS. 9A and 9B are cross-sectional views of an apparatus for performingrigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus including retractablepins, rods or the like for selectively providing separation betweensubstrates/layers (FIG. 9A) and non-separation between substrates/layers(ex—pins are retracted, as in FIG. 9B) in accordance with an exemplaryembodiment of the present invention;

FIG. 10 is a cross-sectional view of an apparatus for performingrigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus including retractablepins for providing selective separation between substrates/layers, saidapparatus further including equalization ports for allowing selectivepressure establishment (ex—via slow leak) within the sealed sub-cavitiesin accordance with an exemplary embodiment of the present invention;

FIG. 11 illustrates a cross-sectional view of an apparatus forperforming rigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus being oriented suchthat pressure(s) is/are applied along a horizontal plane/axis tomultiple laminate assembly stacks in accordance with an exemplaryembodiment of the present invention;

FIG. 12 illustrates a top view of an apparatus for performingrigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus including a pluralityof sealed sub-cavities/pressure zones in accordance with an exemplaryembodiment of the present invention;

FIG. 13 illustrates a cross-sectional view of an apparatus forperforming rigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA), said apparatus being oriented suchthat pressures are applied in opposing directions against a laminateassembly stack via dual flexible membranes in accordance with anexemplary embodiment of the present invention;

FIG. 14 is a flowchart illustrating a process for performingrigid-to-rigid substrate lamination implementing pressure-sensitiveadhesive (PSA) in accordance with an exemplary embodiment of the presentinvention;

FIG. 15 is a flowchart illustrating a process for performingrigid-to-rigid substrate lamination implementing pressure-sensitiveadhesive (PSA) in accordance with an exemplary embodiment of the presentinvention;

FIG. 16 is a flowchart illustrating a process for performingrigid-to-rigid substrate lamination implementing pressure-sensitiveadhesive (PSA) in accordance with an exemplary embodiment of the presentinvention;

FIG. 17 is a flowchart illustrating a process for performingrigid-to-rigid substrate lamination implementing pressure-sensitiveadhesive (PSA) in accordance with an exemplary embodiment of the presentinvention; and

FIG. 18 is a flowchart illustrating a process for performingrigid-to-rigid substrate lamination implementing pressure-sensitiveadhesive (PSA) in accordance with an exemplary embodiment of the presentinvention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Reference will now be made in detail to the presently preferredembodiments of the invention, examples of which are illustrated in theaccompanying drawings.

Referring generally to FIGS. 1-13, various embodiments of an apparatusfor performing rigid-to-rigid substrate lamination processesimplementing pressure-sensitive adhesive (PSA) are shown in accordancewith the present invention. For example, the apparatus may be alamination tool, such as for laminating display assemblies. Further, PSAmay encompass commercially available PSA (ex—dry film pressure-sensitiveadhesive, acrylic lamination material), which has undergoneplanarization treatment as described in United States patent applicationentitled: “Planarization Treatment of Pressure Sensitive Adhesive forRigid-to-Rigid Substrate Lamination” filed Jan. 18, 2008 and havingExpress Mail Mailing Label Number EM 117518653 US which is incorporatedby reference in its entirety herein. In exemplary embodiments of thepresent invention, rigid-to-rigid lamination processes may encompassprocesses as shown and described in the United States patent applicationentitled: “Substrate Lamination System and Method” filed Jan. 18, 2008and having Express Mail Mailing Label Number EM 117518596 US; and theUnited States patent application entitled: “Substrate Lamination Systemand Method” filed Jan. 18, 2008 and having Express Mail Mailing LabelNumber EM 117518605 US (both of which are incorporated by reference intheir entireties herein), in which rigid substrates are joined/securedtogether via the PSA, said substrates may be display assemblycomponents, such as optical or non-optical substrates, or sheet-likeassemblies (ex—Liquid Crystal Displays (LCDs)/LCD modules, OrganicLight-Emitting Diodes (OLEDs), Circuit Boards, Heat Sinks, cover glassfor LCD modules, etc.). The rigid-to-rigid lamination processes of thepresent invention involve applying pressure to the substrates in acontrolled or selective manner so as to promote minimization of gasentrapment/air bubbles between substrates during assembly/lamination,thereby promoting reduced occurrences of the appearance of undesirableoptical effects or visual anomalies in the laminated assembly(ex—blotches or voids on a display).

Referring generally to FIGS. 1 and 2, an apparatus 100 for performingrigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA) is shown. The apparatus 100 mayinclude a base portion 102. For instance, the base portion 102 may be arectilinearly-shaped, tray-like device. Further, the base portion 102may include a support surface 104 configured for supporting one or morelaminate assembly stacks 106, 108, 110. In exemplary embodiments, eachlaminate assembly stack (106, 108, 110) may include a first substrate112 (which may be positioned directly on/in direct physical contact withthe support surface 104), a second substrate 114, and one or more PSAlayers 116 positioned or “sandwiched” between the first substrate 112and the second substrate 114. For example, the first substrate 112 maybe a cover glass layer for an LCD module, while the second substrate 114may be an LCD module. Further, the one or more PSA layers 116 may bepre-adhered to the first substrate 112 and/or second substrate 114 priorto lamination (ex—prior to placement on the support surface 104). Asshown in FIG. 2, one or more substrates and/or layers, such as the firstsubstrate 112 of each laminate assembly stack (106, 108, 110) may beshared between/may be common to each of the stacks. For example, thefirst substrate 112 may be a single sheet of cover glass having multiplesecond substrates 114 (ex—LCD modules) and multiple PSA layers 116stacked upon it so that multiple LCD modules may be laminated to thesingle sheet of cover glass.

In an exemplary embodiment, the apparatus 100 may include a coverportion 118. Further, the cover portion 118 may be connectedto/configured for being connected with the base portion 102. Forinstance, the cover portion 118 may be attached to base portion 102 in aclamshell-style configuration. In further embodiments, the cover portion118 is configured for forming an enclosure 120 with the base portion 102when the apparatus 100 is established in a closed position (ex—if theassembly 100 is a clamshell-style configuration, the closed position(shown in FIGS. 1, 2) is when the cover portion 118 is “flipped down”onto/over the base portion 102 and/or secured against the base portion,thereby closing or sealing the enclosure 120).

In current embodiments of the present invention, the apparatus 100 mayinclude a flexible membrane 122. The flexible membrane 122 may beconfigured for being: a.) connected to the cover portion 118, b.)connected to the base portion 102 and/or c.) positioned(ex—“sandwiched”) between the base portion 102 and the cover portion118. In further embodiments, the flexible membrane 122 may beconnected/positioned in such a manner that the flexible membrane 122 andthe cover portion 118 form a first sealed cavity 124 when the apparatus100 is established in the closed position. In additional embodiments,the flexible membrane 122 may be connected/positioned in such a mannerthat the flexible membrane 122 and the base portion 102 form a secondsealed cavity 126 when the apparatus 100 is established in the closedposition.

In an exemplary embodiment, the base portion 102 may be configured witha vacuum port 128 for allowing the base portion 102 of the apparatus 100to be connected with a vacuum pump. In further embodiments, the coverportion 118 may be configured with a pressurization port 130 forallowing the cover portion 118 of the apparatus 100 to be connected witha pressurization source. In additional embodiments, when the vacuum port128 is connected with the vacuum pump, a vacuum 132 may be createdwithin the second sealed cavity 126, thereby subjecting the laminateassembly stacks (106, 108, 110) to vacuum/vacuum pressure. In stillfurther embodiments, when the pressurization port 130 is connected withthe pressurization source, a pressure 134 may be created within thefirst sealed cavity 124. In additional embodiments, the pressure 134created within the first sealed cavity 124 exerts against the flexiblemembrane 122 (ex—creates a backpressure on the flexible membrane 122),thereby causing the flexible membrane 122 to apply the created pressureto the laminate assembly stack(s) (106, 108, 110) by expanding againstthe second substrate(s) 114 of the laminate assembly stacks, saidlaminate assembly stacks being supported on the support surface 104 ofthe base portion 102. In exemplary embodiments, the flexible membrane122 may be formed of an elastic material, such as silicone. Stillfurther, the material forming the flexible membrane 122 may be chosenbased on properties such as electrostatic discharge (ESD) properties,tear strength, elongational properties, or the like. Further, theflexible membrane 122 may be coated with one or more layers of plastic(ex—polyethylene) or other like material, the surface of which won'thold an electric-charge (ex—an electric charge won't be created on itssurface) when said material is peeled/pulled away/removed from anothermaterial/surface.

In current embodiments of the present invention, the laminate assemblystacks (106, 108, 110) may be concurrently subjected to the createdpressure within the first sealed cavity/flexible membrane-appliedpressure 134 and the vacuum 132 created within the second sealed cavity126. By concurrently subjecting the laminate assembly stacks (106, 108,110) to the flexible membrane-applied pressure 134 and the vacuum 132,intimate substrate (112, 114) contact via the PSA 116 may be promoted,such that entrapment of air/gas bubbles between the substrates (112,114) is reduced or minimized, thereby reducing the likelihood thatvoids, optical anomalies/non-uniformities, or the like will appear inlaminated display assemblies produced via rigid-to-rigid laminationprocesses implementing the apparatus 100 of the present invention.

In exemplary embodiments, the apparatus 100 may include a protectivecarriage, mask, or insert 136. The protective carriage 136 may beconfigured for being removably placed upon the support surface 104. Forinstance, the protective carriage 136 may be a rectilinearly-shaped lidor cover-like structure which may be seated within or on acorrespondingly-shaped/sized tray-like or pan-like base portion 102 andupon the support surface 104. In further embodiments, when theprotective carriage 136 is seated upon the support surface 104, theprotective carriage 136 and the support surface 104 form a partialenclosure 138. The protective carriage 136 may function to protectsensitive components of the substrate(s) (112, 114), such as boards andflex circuits of an LCD module, from being subjected to physical contactwith and/or pressure applied by the flexible membrane 122.

In further embodiments, a surface of the carriage 136 may form one ormore apertures 140/may have one or more apertures 140 formedtherethough. Further, the apertures 140 may be shaped/sized for allowingphysical access to the laminate assembly stacks (106, 108, 110)positioned on the support surface 104. As previously discussed, when thecarriage 136 of the present invention is seated upon the support surface104 and within the base portion 102, the support surface 104 and thecarriage 136 form a partial enclosure 138. Still further, the apertures140 formed by the carriage 136 may allow physical access to the laminateassembly stacks (106, 108, 110) (ex—access to the second/top substrates114 of the stacks) when the laminate assembly stacks are positioned onthe support surface 104. For instance, the apertures 140 may be formedsuch that when the carriage 136 is positioned on the support surface 104and within or on the base portion 102, said apertures 140 may bealigned, shaped and sized so as to promote ease of physical access tolaminate assembly stacks (106, 108, 110) positioned on the supportsurface 104. For example, the pressure 134 (ex—positive pressure)created within the first sealed cavity 124 may cause the flexiblemembrane 122 to expand and be directed through/via the apertures 140 ofthe carriage 136 and against the second substrates 114 (ex—LCDmodule(s)) of the laminate assembly stacks (106, 108, 110), therebysqueezing the laminate assembly stacks between the flexible membrane 122and the support surface 104 and causing intimate contact between thesubstrates 112, 114 via the PSA 116. Further, the number of apertures140 of the carriage 136 may be equivalent to the number of laminateassembly stacks (106, 108, 110) positioned on the support surface 104.

In exemplary embodiments, the pressure 134 applied by the flexiblemembrane 122 may be selectably controlled, such that the magnitude ofsaid pressure 134 may be ramped or varied over time, and/or held at auniform level for a duration of time for promoting intimate contact(ex—minimized air/gas entrapment) between the substrates (112, 114) viathe PSA 116. In further embodiments, the pressure 134 applied by theflexible membrane may be selectably controlled to be applied for aselected or desired duration of time for promoting intimate contactbetween the substrates (112, 114).

FIG. 3 illustrates an alternative embodiment of an apparatus forperforming rigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA). In the illustrated embodiment, thecover portion 118 of the apparatus 300 may form a plurality of coverpartitions 142, 144, 146. For example, a first cover partition 142 maybe configured for forming a first sealed sub-cavity 148 with theflexible membrane 122 when the apparatus 300 is established in theclosed position. Further, a second cover partition 144 may be configuredfor forming a second sealed sub-cavity 150 with the flexible membrane122 when the apparatus 300 is established in the closed position. Stillfurther, a third cover partition 146 may be configured for forming athird sealed sub-cavity 152 with the flexible membrane 122 when theapparatus 300 is established in the closed position. Further, theapparatus 300 may include multiple pressurization ports (302, 304, 306)for allowing the cover portion 118 to be connected with multiplecorresponding pressurization sources. In current embodiments of thepresent invention, a first pressurization port 302 may be connected to afirst pressurization source for pressurizing the first sealed sub-cavity148 to a first pressure 154, a second pressurization port 304 isconnected to a second pressurization source for pressurizing the secondsealed sub-cavity 150 to a second pressure 156, and a thirdpressurization port 306 is connected to a third pressurization sourcefor pressurizing the third sealed sub-cavity 152 to a third pressure158.

The apparatus 300 of FIG. 3 does not implement a carriage 136, butrather, the support surface 104 of the apparatus 300 is formed/contouredto include a plurality of base receptacles (160, 162, 164). The laminateassembly stacks (106, 108, 110) may be placed in the base receptacles(160, 162, 164) and/on the support surface 104. Each of the receptacles(160, 162, 164) is configured for forming a sealed base sub-cavity withthe flexible membrane 122 when the apparatus 300 is established in theclosed position. For example, a first receptacle 160 may form a firstsealed base sub-cavity 166 with the flexible membrane 122, a secondreceptacle 162, may form a second sealed base sub-cavity 168 with theflexible membrane 122 and a third receptacle 164 may form a third sealedbase sub-cavity 170 with the flexible membrane 122. Further, each basereceptacle (160, 162, 164) may be configured so that the flexiblemembrane 122 may expand into each of the sealed base sub-cavities (166,168, 170) to apply pressure to/contact the laminate assembly stack(s)(106, 108, 110).

In further embodiments, the base portion 102 of the apparatus 300includes a plurality of vacuum ports (308, 310, 312) which may beconnected to a plurality of corresponding vacuum pumps for creating avacuum within each of the sealed base sub-cavities (166, 168, 170). Theflexible membrane 122 may exert the first pressure 154 upon the firstlaminate assembly stack 106, the flexible membrane 122 may exert thesecond pressure 156 upon the second laminate assembly stack 108, and theflexible membrane 122 may exert the third pressure 158 upon the thirdlaminate assembly stack 110. The first, second, and third pressures(154, 156, 158) may differ in magnitude from one another and may beselectably established/chosen based upon substrate (112, 114)characteristics, such as thickness, etc., for promoting intimate contactbetween the substrates (112, 114).

FIGS. 4 and 5 illustrate a further alternative embodiment of anapparatus for performing rigid-to-rigid substrate lamination processesimplementing pressure-sensitive adhesive (PSA). The apparatus 400 allowsfor a first pressure 154 created within the first sealed sub-cavity 148to be applied via the flexible membrane 122 to the first laminateassembly stack 106, a second pressure 156 created within the secondsealed sub-cavity 150 to be applied via the flexible membrane 122 to thesecond laminate assembly stack 108, and a third pressure 158 createdwithin the third sealed sub-cavity 152 to be applied via the flexiblemembrane 122 to the third laminate assembly stack 110. Further, thevacuum port 128 may be connected to a vacuum source for concurrentlyapplying a vacuum 132 to the laminate assembly stacks (106, 108, 110),said stacks being positioned within the sealed cavity 126 formed by thebase portion 102 and the flexible membrane 122 for promoting intimatecontact between the substrates (112, 114). Alternatively, (as shown inFIG. 5) the first, second, and third pressures (154, 156, 158) may beapplied by the flexible membrane 122 to a single laminate assembly stack106. As previously described, the first, second, and third pressures maybe different magnitudes/values from each other, may be the samemagnitude/value, may be applied for varying durations, at varyingintensities, may be applied in a uniform manner, or the like.

FIGS. 6 and 7 illustrate a further alternative embodiment of anapparatus for performing rigid-to-rigid substrate lamination processesimplementing pressure-sensitive adhesive (PSA) in which the apparatus600 includes multiple flexible membranes (602, 604, 606) for applying afirst pressure 154, a second pressure 156, and a third pressure 158 toone or more laminate assembly stacks (106, 108, 110), while concurrentlyapplying a vacuum 132 to the one or more stacks. For instance, as shownin FIG. 6, a first flexible membrane 602 applies the first pressure 154to a first stack 106, a second flexible membrane 604 applies the secondpressure 156 to a second stack 108, and a third flexible membrane 606applies the third pressure 158 to a third stack 110. Alternatively, inFIG. 7, the first, second and third flexible membranes (602, 604, 606)apply the first, second and third pressures (154, 156, 158)respectively, to a single laminate assembly stack 106 (such as whenlaminating larger substrates for providing a larger display assembly).

FIG. 8 illustrates a further alternative embodiment of an apparatus forperforming rigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA) in which the laminate assembly stacks(106, 108, 110) are supported on the support surface 104 of theapparatus 800. Further, the base portion 102 and the cover portion 118form a sealed enclosure 802 when the apparatus 800 is in the closedposition. The apparatus 800 includes one or more vacuum ports 804configured for connection to vacuum source(s) for applying a vacuumto/creating a vacuum within the sealed enclosure 802. In the illustratedembodiment, the apparatus 800 relies on the weight of the substrates 112rather than flexible membrane-applied pressure to create the force forcreating intimate substrate contact. Said vacuum may also beconcurrently applied to promote intimate substrate contact. Saidapparatus 800 may be suitable for lamination of heavier/larger displaydevice substrates (112, 114).

In further embodiments of the present invention, as shown in FIG. 9A,FIG. 9B, and FIG. 10, the apparatus (900, 1000) may be configured forallowing the substrates/layers (112, 114, 116) to contact each other ina gradual manner. In exemplary embodiments, the apparatus may beconfigured with a separating mechanism, such as one or more retractablepins, rods or the like (902, 1002) for maintaining spacing or separationbetween the substrates/layers (112, 114, 116). For instance, prior toapplication of pressure, such as via a flexible membrane 122, one ormore of the substrates/layers 112, 114, 116 positioned within theapparatus (900, 1000) may be separated by the retractable pins (902,1002). For example, one or more of the substrates/layers (112, 114, 116)may be completely separated from another of the substrates/layers (112,114, 116), as shown in FIG. 10. Alternatively, one or more of thesubstrates/layers (112, 114, 116) may be only partially separated fromanother of the substrates/layers (112, 114, 116), as shown in FIG. 9A.In further embodiments, said pins (902, 1002) may begradually/selectively retracted for allowing the substrates/layers (112,114, 116) to come into contact/come into further (ex—greater surfacearea) contact with one another. During such separation and/or duringsuch time as the substrates/layers (112, 114, 116) come intocontact/come into further contact with one another, a vacuum may beapplied for promoting prevention of gas entrapment between substratesand allowing intimate substrate contact. Further, during such time asthe substrates/layers (112, 114, 116) come into contact/come intofurther contact with one another, pressure(s) may be applied forpromoting intimate substrate (112, 114) contact and gas bubble-freeadhesion/lamination via the PSA 116. Further, the pressure(s) may beapplied sequentially and/or at different regions/locations along asurface of the first/top substrate 112, or gradually (such as via apressure wave or gradient along/across/over a surface of the first/topsubstrate 112), the pressure wave allowing for a gradual squeezingtogether of substrates, such as in a wave-like manner, for providingintimate substrate (112, 114) contact via the PSA 116.

For instance, FIG. 9A illustrates partial separation between thefirst/top substrate 112 and the PSA layer 116 as maintained by theretractable pin. Further, pressure may be applied gradually/in awave-like manner (ex—via a pressure gradient) to the laminate assemblystack 106. For example, a first pressure 904 created within a firstsealed sub-cavity 906 may initially be applied to the laminate assemblystack 106 via a first flexible membrane 908 (either during initialseparation, as shown in FIG. 9A, or after retraction of the pins 902.Further, a second pressure 910 created within a second sealed sub-cavity912 may then be applied to the laminate assembly stack 106 via a secondflexible membrane 914, as shown in FIG. 9B. For instance, the secondpressure 910 may be the same magnitude or a differentmagnitude/value/amount than the first pressure 904 and may be applied inconjunction with/concurrently with the first pressure 904 (as shown inFIG. 9B) and after refraction of the pins 902, (also shown in FIG. 9B).Still further, a third pressure 916 created within a third sealedsub-cavity 918 may then be applied to the laminate assembly stack 106via a third flexible membrane 920. (see FIG. 9B). For example, the thirdpressure 916 may be applied in conjunction with/concurrently with thefirst pressure 904 and/or second pressure 910 (as shown in FIG. 9B) andafter refraction of the pins 902 (also shown in FIG. 9B). Suchsequential application of pressure, such as in the gradually increasingwave-like gradient shown in FIGS. 9A & 9B, in conjunction with theapplied vacuum 132 may promote intimate (ex—bubble-free) contact betweensubstrates/layers (112, 114, 116). It is contemplated by the presentinvention that the pressures (904, 910, 916) may be selectably appliedin various combinations (ex—one at a time or in combination), at variousmagnitudes, points in time, and for varying durations along variousportions/at various locations along a surface (top substrate 112) of thelaminated substrate assembly 106

In FIG. 10, the cover portion 118 of the apparatus is partitioned into aplurality of sealed sub-cavities (1004, 1006, 1008). The cover portion118 is further configured with one or more equalizing ports (1010,1012). Each equalizing port (1010, 1012) may be configured to allow forselective establishment of pressure equalization and/or variationbetween the sealed sub-cavities (1004, 1006, 1008). For example, a firstequalizing port 1010 (ex—a one-way valve) may be configured through afirst wall 1014, said first wall 1014 physically separating a firstsealed sub-cavity 1004 and the second sealed sub-cavity 1006. Further,the first equalizing port 1010 may be selectively actuated (ex—opened)to allow a first pressure 1016 created within the first sealedsub-cavity 1004 (via a pressurization port 1018 configured through thecover portion 118) to be at least partially released or bled into asecond sealed sub-cavity 1006 for creating a second pressure 1020 withinthe second sealed sub-cavity 1006. Once the second pressure 1020 isestablished at a desired level/magnitude, the first equalizing port 1010may be further actuated (ex—closed) to prevent further pressure releasefrom the first sealed sub-cavity 1004 to the second sealed sub-cavity1006. Still further, a second equalizing port 1012 may be establishedthrough a second wall 1022, said second wall 1022 physically separatingthe second sealed sub-cavity 1006 and a third sealed sub-cavity 1008.Further, the second equalizing port 1012 may be selectively actuated toallow the second pressure 1020 to be at least partially released or bledinto the third sealed sub-cavity 1008 for creating a third pressure 1024within the third sealed sub-cavity 1008. Once the third pressure 1024 isestablished at a desire level/magnitude, the second equalization port1012 may be further actuated to prevent further pressure release fromthe second sealed sub-cavity 1006 to the third sealed sub-cavity 1008.The equalizing ports 1010, 1012 may be implemented for providing a slowleak effect, which allows for multiple and/or varying pressures to beapplied (such as via the flexible membranes 122) to a laminate assemblystack 106 in a localized and/or sequential and/or gradient like mannerwithout having to connect the apparatus 1000 with multiple pressuresources. Further, a vacuum 132 may be applied to said laminate assemblystack 106 for promoting intimate substrate (112, 114) contact via thePSA 116. In further embodiments, a single, continuous, flexible membrane122 (as shown in FIG. 11) rather than multiple flexible membranes (908,914, 920) may be implemented with the embodiments of the apparatus (900,1000) shown in FIGS. 9A, 9B and 10.

In further embodiments, such as in FIG. 11, an apparatus 1100 forperforming rigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA) is shown, said apparatus 1100 may beoriented along a vertical axis, such that pressure 1102 may be appliedalong a horizontal axis to laminate assembly stacks (106, 108, 110).

In additional embodiments, as in FIG. 12, a top view of an apparatus1200 for performing rigid-to-rigid substrate lamination processesimplementing pressure-sensitive adhesive (PSA) is shown as having aplurality of sealed sub-cavities or pressure zones 1202 in which varyingpressures may be created and applied, such as via flexible membranes 122at various locations on/along substrate surfaces of one or more laminatesubstrate assemblies (106, 108, 110).

In an alternative embodiment, as shown in FIG. 13, an apparatus 1300 forperforming rigid-to-rigid substrate lamination processes implementingpressure-sensitive adhesive (PSA) is shown, said apparatus 1300 may beoriented along a vertical axis (as in FIG. 11) and may be similar tothat shown in FIG. 8 of United States patent application entitled:“Alignment System and Method Thereof” filed Jan. 18, 2008 and havingExpress Mail Mailing Label Number EM 117518667 US, which is hereinincorporated by reference in its entirety. The apparatus 1300 may form asealed enclosure 1301 and may include a first flexible membrane 1302 anda second flexible membrane 1304. The first flexible membrane 1302 and afirst interior surface 1306 of the apparatus 1300 may be connected so asto form a first sealed cavity 1308. The second flexible membrane 1304and a second interior surface 1310 of the apparatus 1300 may beconnected so as to form a second sealed cavity 1312.

Further, the apparatus 1300 may be configured with a firstpressurization port 1314, said first pressurization/vacuum port 1314configured for being connected to a pressurization source forpressurizing the first sealed cavity 1308, said firstpressurization/vacuum port 1314 further configured for being connectedto a vacuum pump for creating a vacuum within the first sealed cavity1308. The apparatus 1300 may also be configured with a secondpressurization/vacuum port 1316, said second pressurization/vacuum port1316 configured for being connected to a pressurization source forpressurizing the second sealed cavity 1312, said secondpressurization/vacuum port 1316 further configured for being connectedto a vacuum pump for creating a vacuum within the second sealed cavity1312. A first pressure 1318 may be created within the first sealedcavity 1308 via the first pressurization/vacuum port 1314. Further, asecond pressure 1320 may be created within the second sealed cavity 1312via the second pressurization/vacuum port 1316. The first pressure 1318may be applied via the first flexible membrane 1302 against a laminateassembly stack 106 which is positioned within the apparatus 1300. Thesecond pressure 1320 may also be applied via the second flexiblemembrane 1304 against the laminate assembly stack 106. In additionalembodiments, prior to creating the first pressure 1318 within the firstsealed cavity 1308 and prior to creating the second pressure 1320 withinthe second sealed cavity 1312, a first vacuum 1319 may be created withinthe first sealed cavity 1308 via the first pressurization/vacuum port1314 and a second vacuum 1321 may be created within the second sealedcavity 1312 via the second pressurization/vacuum port 1316. Creatingsaid vacuums 1319, 1321 prior to creating said pressures 1318, 1320 maybe done to prevent stress or damage to the first and second flexiblemembranes 1302, 1304.

As shown in FIG. 13, the first pressure 1318 may be applied in a firstdirection along a horizontal axis and the second pressure 1320 may beapplied in a second direction along a horizontal axis, the seconddirection being a generally opposite direction from the first direction.Applying pressure to the laminate assembly stack 106 in such a mannercauses the laminate assembly stack 106 to be squeezed between theflexible membranes (1302, 1304) for promoting intimate substrate (112,114) contact via the PSA (116) for the laminate assembly stack 106.Further, the apparatus 1300 may be configured with one or more vacuumports 1328 via which a vacuum 1324 may be created within the apparatus1300. Said vacuum 1324 may be concurrently applied to said laminateassembly stack for promoting intimate substrate contact. The firstpressure 1318 and the second pressure 1320 may be the same or differentmagnitudes, may be applied for the same or varying durations, may beapplied in a ramped or uniform manner, as a pressure gradient, in such amanner as to gradually cause substrates/layers (112, 114, 116) to comeinto contact, such as when standoffs/pegs/retractable pins 1326 areimplemented, or in any variations as described in the embodimentsherein. For instance, the apparatus 1300 may be configured with one ormore of a plurality of positioning ports 1322, said positioning ports1322 being configured for receiving one or more of the retractablepins/pegs 1326 to allow said pins/pegs 1326 to be selectively positionedfor supporting/separating the substrates/layers (112, 114, 116).Further, said positioning ports 1322 may be threaded for receivingcorrespondingly threaded pins/pegs 1326.

Referring generally to FIGS. 14-18, process for performingrigid-to-rigid substrate lamination implementing pressure-sensitiveadhesive (PSA) are shown in accordance with exemplary embodiments of thepresent invention. In FIG. 14, a process 1400 for performingrigid-to-rigid substrate lamination implementing pressure-sensitiveadhesive (PSA) may include the steps of: pressurizing a first sealedcavity to a first pressure 1402; creating a vacuum within a secondsealed cavity, the second sealed cavity being sealed from the firstsealed cavity by a flexible membrane 1404; applying the first pressureto a laminate assembly stack via the flexible membrane, the laminateassembly stack including a first substrate, a second substrate, and aPSA layer, the PSA layer being positioned between the first substrateand the second substrate 1406; and applying the vacuum created withinthe second sealed cavity to the laminate assembly stack 1408. Theapplied first pressure and the applied vacuum promote intimate contactbetween the first substrate and the second substrate of the laminateassembly stack via the PSA layer.

In FIG. 15, a process 1500 for performing rigid-to-rigid substratelamination implementing pressure-sensitive adhesive (PSA) is shown whichmay include the steps of: pressurizing a first sealed sub-cavity to afirst pressure 1502; creating a first vacuum pressure within a firstsealed base sub-cavity, the first sealed base sub-cavity being sealedfrom the first sealed sub-cavity by a flexible membrane 1504;pressurizing a second sealed sub-cavity to a second pressure 1506;creating a second vacuum pressure within a second sealed basesub-cavity, the second sealed base sub-cavity being sealed from thesecond sealed sub-cavity by the flexible membrane 1508; applying thefirst pressure to a first laminate assembly stack via the flexiblemembrane, the first laminate assembly stack including a first substrate,a second substrate, and a PSA layer, the PSA layer being positionedbetween the first substrate and the second substrate 1510; applying thefirst vacuum pressure created within the first sealed base sub-cavity tothe first laminate assembly stack 1512; applying the second pressure toa second laminate assembly stack via the flexible membrane, the secondlaminate assembly stack including a first substrate, a second substrate,and a PSA layer, the PSA layer being positioned between the firstsubstrate and the second substrate 1514; and applying the second vacuumpressure created within the second sealed base sub-cavity to the secondlaminate assembly stack 1516. The applied first pressure and the appliedfirst vacuum pressure promote intimate contact between the firstsubstrate and the second substrate of the first laminate assembly stackvia the PSA layer of the first laminate assembly stack, wherein theapplied second pressure and the applied second vacuum pressure promoteintimate contact between the first substrate and the second substrate ofthe second laminate assembly stack via the PSA layer of the secondlaminate assembly stack.

In FIG. 16, a process 1600 for performing rigid-to-rigid substratelamination implementing pressure-sensitive adhesive (PSA) is shown whichmay include the steps of: pressurizing a first sealed sub-cavity to afirst pressure 1602; creating a vacuum pressure within a sealed cavity,the sealed cavity being sealed from the first sealed sub-cavity by aflexible membrane 1604; pressurizing a second sealed sub-cavity to asecond pressure, the second sealed sub-cavity being sealed from thesealed cavity by the flexible membrane 1606; applying the first pressureto a first laminate assembly stack via the flexible membrane, the firstlaminate assembly stack including a first substrate, a second substrate,and a PSA layer, the PSA layer being positioned between the firstsubstrate and the second substrate 1608; applying the vacuum pressurecreated within the sealed cavity to the first laminate assembly stack1610; applying the second pressure to a second laminate assembly stackvia the flexible membrane, the second laminate assembly stack includinga first substrate, a second substrate, and a PSA layer, the PSA layerbeing positioned between the first substrate and the second substrate1612; and applying the vacuum pressure created within the sealed cavityto the second laminate assembly stack 1614. The applied first pressureand the applied vacuum pressure promote intimate contact between thefirst substrate and the second substrate of the first laminate assemblystack via the PSA layer of the first laminate assembly stack, whereinthe applied second pressure and the applied vacuum pressure promoteintimate contact between the first substrate and the second substrate ofthe second laminate assembly stack via the PSA layer of the secondlaminate assembly stack.

In FIG. 17, a process 1700 for performing rigid-to-rigid substratelamination implementing pressure-sensitive adhesive (PSA) is shown whichmay include the steps of: pressurizing a first sealed sub-cavity to afirst pressure 1702; creating a vacuum pressure within a sealed cavity,the sealed cavity being sealed from the first sealed sub-cavity by aflexible membrane 1704; pressurizing a second sealed sub-cavity to asecond pressure, the second sealed sub-cavity being sealed from thesealed cavity by the flexible membrane 1706; applying the first pressureto a laminate assembly stack at a first location on the laminateassembly stack via the flexible membrane, the laminate assembly stackincluding a first substrate, a second substrate, and a PSA layer, thePSA layer being positioned between the first substrate and the secondsubstrate 1708; applying the vacuum pressure created within the sealedcavity to the laminate assembly stack 1710; and applying the secondpressure to the laminate assembly stack at a second location on thelaminate assembly stack via the flexible membrane, the second locationbeing different than the first location 1712. The applied firstpressure, the applied second pressure, and the applied vacuum pressurepromote intimate contact between the first substrate and the secondsubstrate of the laminate assembly stack via the PSA layer of thelaminate assembly stack.

In FIG. 18, a process 1800 for performing rigid-to-rigid substratelamination implementing pressure-sensitive adhesive (PSA) is shown whichmay include the steps of: pressurizing a first sealed sub-cavity to afirst pressure 1802; creating a vacuum pressure within a sealed cavity,the sealed cavity being sealed from the first sealed sub-cavity by afirst flexible membrane 1804; pressurizing a second sealed sub-cavity toa second pressure, the second sealed sub-cavity being sealed from thesealed cavity by a second flexible membrane 1806; applying the firstpressure to a first laminate assembly stack via the first flexiblemembrane, the first laminate assembly stack including a first substrate,a second substrate, and a PSA layer, the PSA layer being positionedbetween the first substrate and the second substrate 1808; applying thesecond pressure to a second laminate assembly stack via the secondflexible membrane, the second laminate assembly stack including a firstsubstrate, a second substrate, and a PSA layer, the PSA layer beingpositioned between the first substrate and the second substrate 1810;and applying the vacuum pressure created within the sealed cavity to thefirst laminate assembly stack and the second laminate assembly stack1812. The applied first pressure and the applied vacuum pressure promoteintimate contact between the first substrate and the second substrate ofthe first laminate assembly stack via the PSA layer of the firstlaminate assembly stack, wherein the applied second pressure and theapplied vacuum pressure promote intimate contact between the firstsubstrate and the second substrate of the second laminate assembly stackvia the PSA layer of the second laminate assembly stack.

It is to be noted that the foregoing described embodiments according tothe present invention may be conveniently implemented using conventionalgeneral purpose digital computers programmed according to the teachingsof the present specification, as will be apparent to those skilled inthe computer art. Appropriate software coding may readily be prepared byskilled programmers based on the teachings of the present disclosure, aswill be apparent to those skilled in the software art.

It is to be understood that the present invention may be convenientlyimplemented in forms of a software package. Such a software package maybe a computer program product which employs a computer-readable storagemedium including stored computer code which is used to program acomputer to perform the disclosed function and process of the presentinvention. The computer-readable medium may include, but is not limitedto, any type of conventional floppy disk, optical disk, CD-ROM, magneticdisk, hard disk drive, magneto-optical disk, ROM, RAM, EPROM, EEPROM,magnetic or optical card, or any other suitable media for storingelectronic instructions.

It is understood that the specific order or hierarchy of steps in theforegoing disclosed methods are examples of exemplary approaches. Basedupon design preferences, it is understood that the specific order orhierarchy of steps in the method can be rearranged while remainingwithin the scope of the present invention. The accompanying methodclaims present elements of the various steps in a sample order, and arenot meant to be limited to the specific order or hierarchy presented.

It is believed that the present invention and many of its attendantadvantages will be understood by the foregoing description. It is alsobelieved that it will be apparent that various changes may be made inthe form, construction and arrangement of the components thereof withoutdeparting from the scope and spirit of the invention or withoutsacrificing all of its material advantages. The form herein beforedescribed being merely an explanatory embodiment thereof, it is theintention of the following claims to encompass and include such changes.

What is claimed is:
 1. An apparatus for performing rigid-to-rigidsubstrate lamination processes implementing pressure-sensitive adhesive(PSA), comprising: a base portion, the base portion being configuredwith a support surface for supporting at least one laminate assemblystack, each laminate assembly stack included in the at least onelaminate assembly stack including at least one layer of PSA, a firstsubstrate, and a second substrate, the at least one layer of PSA beingpositioned between the first substrate and the second substrate, thebase portion being further configured with a vacuum port for allowingthe base portion to be connected with a vacuum pump; a cover portionconfigured for being connected with the base portion, the cover portionfurther configured for forming an enclosure with the base portion whenthe apparatus is established in a closed position, the cover portionbeing configured with at least one pressurization port for allowing thecover portion to be connected with at least one pressurization source;at least one flexible membrane configured for being at least one ofconnected to the cover portion, connected to the base portion, orpositioned between the cover portion and the base portion, the at leastone flexible membrane and the cover portion forming a first sealedcavity when the apparatus is established in the closed position, the atleast one flexible membrane and base portion forming a second sealedcavity when the apparatus is established in the closed position, when apressure is created within the first sealed cavity via thepressurization port and when a vacuum is created within the secondsealed cavity via the vacuum port, the at least one flexible membranefurther configured for applying said pressure to the at least onelaminate assembly stack while said vacuum is applied to the at least onelaminate assembly stack; and a protective carriage, the protectivecarriage having at least one aperture formed therethrough, theprotective carriage configured for being placed upon the support surfacefor protecting substrate components from the pressure applied by the atleast one flexible membrane, further, the support surface and theprotective carriage being configured for forming a partial enclosurewhen the protective carriage is placed upon the support surface; whereinat least one of a magnitude, duration or location of the appliedpressure is selectably controllable, the applied pressure and appliedvacuum promoting intimate contact between the first substrate and thesecond substrate via the PSA layer(s) for the at least one laminateassembly stack during rigid-to-rigid substrate lamination processes. 2.The apparatus of claim 1, wherein the at least one flexible membrane isconfigured for applying the pressure created within the first sealedcavity to the at least one laminate assembly stack via the at least oneaperture of the protective carriage.
 3. The apparatus of claim 1,wherein at least one of the first substrate, the PSA layer(s) and thesecond substrate are shared between a first laminate assembly stackincluded in the at least one laminate assembly stack and a secondlaminate assembly stack included in the at least one laminate assemblystack.
 4. An apparatus for performing rigid-to-rigid substratelamination processes implementing pressure-sensitive adhesive (PSA),comprising: a base portion, the base portion being configured with asupport surface for supporting at least one laminate assembly stack,each laminate assembly stack included in the at least one laminateassembly stack including at least one layer of PSA, a first substrate,and a second substrate, the at least one layer of PSA being positionedbetween the first substrate and the second substrate, the base portionbeing further configured with a vacuum port for allowing the baseportion to be connected with a vacuum pump; a cover portion configuredfor being connected with the base portion, the cover portion furtherconfigured for forming an enclosure with the base portion when theapparatus is established in a closed position, the cover portion forminga first partition and a second partition, the first partition beingconfigured with a first pressurization port for allowing the firstpartition of the cover portion to be connected with a firstpressurization source; the second partition being configured with asecond pressurization port for allowing the second partition of thecover portion to be connected with a second pressurization source; and aflexible membrane configured for being at least one of connected to thecover portion, connected to the base portion, or positioned between thecover portion and the base portion, the flexible membrane and the firstpartition of the cover portion forming a first sealed sub-cavity whenthe apparatus is established in the closed position, the flexiblemembrane and the second partition forming a second sealed sub-cavitywhen the apparatus is established in the closed position, the flexiblemembrane and base portion forming a sealed cavity when the apparatus isestablished in the closed position, wherein when a first pressure iscreated within the first sealed sub-cavity via the first pressurizationport and when a vacuum is created within the sealed cavity via thevacuum port, the flexible membrane is further configured for applyingthe first pressure to the at least one laminate assembly stack whilesaid vacuum is applied to the at least one laminate assembly stack,wherein when a second pressure is created within the second sealedsub-cavity via the second pressurization port and when the vacuum iscreated within the sealed cavity, the flexible membrane is furtherconfigured for applying the second pressure to the at least one laminateassembly stack, at least one of a magnitude, duration or location of theapplied first pressure and the applied second pressure are selectablycontrollable, the applied first pressure, applied second pressure andapplied vacuum promoting intimate contact between the first substrateand the second substrate of the at least one laminate assembly stack viathe PSA layer(s), during rigid-to-rigid substrate lamination processes.5. The apparatus of claim 4, further comprising: a protective carriage,the protective carriage having a first aperture and a second apertureformed therethrough, the protective carriage configured for being placedupon the support surface for protecting substrate components from thepressure applied by the flexible membrane, further, the support surfaceand the protective carriage being configured for forming a partialenclosure when the protective carriage is placed upon the supportsurface.
 6. The apparatus of claim 5, wherein the flexible membrane isconfigured for applying the first pressure created within the firstsealed sub-cavity to the laminate assembly stack via the first apertureof the protective carriage, the flexible membrane being furtherconfigured for applying the second pressure created with the secondsealed sub-cavity to the laminate assembly stack via the second apertureof the protective carriage.
 7. The apparatus of claim 4, wherein atleast one of the first substrate, the PSA layer(s) and the secondsubstrate are shared between a first laminate assembly stack included inthe at least one laminate assembly stack and a second laminate assemblystack included in the at least one laminate assembly stack.
 8. Anapparatus for performing rigid-to-rigid substrate lamination processesimplementing pressure-sensitive adhesive (PSA), comprising: a baseportion, the base portion being configured with a support surface forsupporting at least one laminate assembly stack, each laminate assemblystack included in the at least one laminate assembly stack including atleast one layer of PSA, a first substrate, and a second substrate, theat least one layer of PSA being positioned between the first substrateand the second substrate, the base portion being further configured witha vacuum port for allowing the base portion to be connected with avacuum pump; a cover portion configured for being connected with thebase portion, the cover portion further configured for forming anenclosure with the base portion when the apparatus is established in aclosed position, the cover portion forming a first partition and asecond partition, the first partition being configured with a firstpressurization port for allowing the first partition of the coverportion to be connected with a first pressurization source; the secondpartition being configured with a second pressurization port forallowing the second partition of the cover portion to be connected witha second pressurization source; and a first flexible membrane and asecond flexible membrane, each configured for being at least one ofconnected to the cover portion, connected to the base portion, orpositioned between the cover portion and the base portion, the firstflexible membrane and the first partition of the cover portion forming afirst sealed sub-cavity when the apparatus is established in the closedposition, the second flexible membrane and the second partition forminga second sealed sub-cavity when the apparatus is established in theclosed position, the first flexible membrane, the second flexiblemembrane and the base portion forming a sealed cavity when the apparatusis established in the closed position, wherein when a first pressure iscreated within the first sealed sub-cavity via the first pressurizationport and when a vacuum is created within the sealed cavity via thevacuum port, the first flexible membrane is further configured forapplying the first pressure to the at least one laminate assembly stackwhile said vacuum is applied to the at least one laminate assemblystack, wherein when a second pressure is created within the secondsealed sub-cavity via the second pressurization port and when the vacuumis created within the sealed cavity, the second flexible membrane isfurther configured for applying the second pressure to the at least onelaminate assembly stack, at least one of a magnitude, duration orlocation of the applied first pressure and the applied second pressureare selectably controllable, the applied first pressure, applied secondpressure and applied vacuum promoting intimate contact between the firstsubstrate and the second substrate of the at least one laminate assemblystack via the PSA layer(s), during rigid-to-rigid substrate laminationprocesses.
 9. The apparatus of claim 8, further comprising: a protectivecarriage, the protective carriage having a first aperture and a secondaperture formed therethrough, the protective carriage configured forbeing placed upon the support surface for protecting substratecomponents from the pressure applied by the first flexible membrane andthe second flexible membrane, further, the support surface and theprotective carriage being configured for forming a partial enclosurewhen the protective carriage is placed upon the support surface.
 10. Theapparatus of claim 9, wherein the first flexible membrane is configuredfor applying the first pressure created within the first sealedsub-cavity to the at least one laminate assembly stack via the firstaperture of the protective carriage, the flexible membrane being furtherconfigured for applying the second pressure created with the secondsealed sub-cavity to the at least one laminate assembly stack via thesecond aperture of the protective carriage.
 11. The apparatus of claim8, further comprising: at least one retractable pin configured formaintaining separation and allowing selective substrate contact for theat least one laminate assembly stack.